Mobio Corporation designs and markets critical RF IC's
and integrated modules for mobile voice and data communications.
With headquarters in Palo Alto, California, USA, we have Corporate
Research Center in Tokyo, Japan and an IC Design and Support
Center in Hsinchu Science Park, Taiwan, targeting the rapidly
growing market in Asia.
Mobio's strong RF design team has many years of experiences
in designing products for wireless communications. Using advanced
HBT technology, we bring new RF products to market
with significant advantages in:
innovative product line covers a full range of RF ICs including
power amplifiers, VCO's and frequency synthesizers. They are
specially designed for applications in cellular phones such
as GSM/GPRS, CDMA, W-CDMA, WiMax, LTE and in high performance wireless
LAN's such as IEEE 802.11a, 802.11b/802.11g standards.